OCZ Ultra 5+ Silver Thermal Paste Compound EOL
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Description
OCZ Ultra 5+ was designed to provide maximum thermal transfer for your most demanding applications. Ultra 5+ contains 99.9% pure silver for optimal thermal transfer and will not dry out, flake or lose thermal transfer ability over time. If you are looking for the absolute best in thermal compound look no further than OCZ Ultra 5+.
Contains 99.9% pure silver: OCZ Ultra 5+ uses three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer. High-Density: OCZ Ultra 5+ contains over 88% thermally Conductive filler by weight. In addition to micronized silver, Ultra 5+ also contains sub-micron zinc oxide, aluminum oxide and boron nitride particles. These thermally-enhanced ceramic particles improve the compound's performance and long-term stability. Not Electrically Conductive: OCZ Ultra 5+ was formulated to conduct heat, not electricity. Absolute Stability: OCZ Ultra 5+ will not separate, run, migrate, or bleed..
Features
- 99.9% Pure Micronized Silver
- 3 Gram Syringe
- Easy to apply
- Thermal Conductance: >350,000W/m2 °C (0.001 inch layer)
- Thermal Resistance: <0.0045°C-in2/Watt (0.001 inch layer
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